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Business > Industrial Devices > Automation Controls Top > Components & Devices > Connectors > High Current Connectors > R35(0.35mm pitch) > Rating/Performance
Supports 5 A for power terminal The ultra-small ( width 1.7mm ) high mating force connector
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Item | Specifications | Conditions | ||
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Electrical characteristics |
Rated current |
Power terminal | Max. 5.0 A/pin contact (2 terminal) | Cu thickness: 35 μm Pattern size: 10 mm (width) |
Signal terminal | Max. 0.3 A/pin contact (All pins can carry; Max. 2 A) |
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Rated voltage | 30 V AC, DC | |||
Dielectric strength | 150 V AC for 1 min. | Detection current: 1 mA | ||
Insulation resistance | Min. 1,000 MΩ (Initial stage) | Using 250 V DC megger (1 min) | ||
Contact resistance |
Power terminal | Max. 30 mΩ | Based on the contact resistance measurement method specified by JIS C 5402 (Current: Power terminal; 1 A, Signal terminal; 1 mA) | |
Signal terminal | Max. 90 mΩ | |||
Mechanical characteristics |
Composite insertion force | 20 or less contacts | Max. 26.0 N (Initial stage) | |
Over 20 contacts | Max. 1.300 N/pin contact x pin contacts (Initial stage) | |||
Composite removal force | Min. 0.165 N/pin contact x pin contacts | |||
Environmental characteristics |
Ambient temperature | -55 to +85°C | Include the calorification from the connector. No icing or condensation. | |
Soldering heat resistance | The initial specification must be satisfied electrically and mechanically. | Max. peak temperature of 260 ℃ Infrared reflow soldering (PC board surface temperature near connector terminals) Soldering iron 300 °C within 5 sec 350 °C within 3 sec | ||
Storage temperature | -55 to +85°C (product only) -40 to +50°C (Packaging structure) |
No icing or condensation. | ||
Thermal shock resistance (header and socket mated) |
After 5 cycles, Insulation resistance: Min. 100 MΩ, Contact resistance: Max. 30 mΩ (Power terminal) Max. 90 mΩ (Signal terminal) |
Conformed to MIL-STD-202F, method 107G |
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Humidity resistance (header and socket mated) |
After 120 hours, Insulation resistance: Min. 100 MΩ, Contact resistance: Max. 30 mΩ (Power terminal) Max. 90 mΩ (Signal terminal) |
Conformed to IEC60068-2-78 Temperature 40±2°C Humidity 90 to 95% RH |
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Saltwater spray resistance (header and socket mated) |
After 24 hours, Insulation resistance: Min. 100 MΩ, Contact resistance: Max. 30 mΩ (Power terminal) Max. 90 mΩ (Signal terminal) |
Conformed to IEC60068-2-11 Temperature 35±2°C Saltwater concentration 5±1% |
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H2S resistance (header and socket mated) |
After 48 hours, Contact resistance: Max. 30 mΩ (Power terminal) Max. 90 mΩ (Signal terminal) |
Temperature 40±2°C, Gas concentration 3±1 ppm, Humidity 75 to 80% RH |
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Lifetime characteristics |
Insertion and removal life | Mechanical life: 30 times Contact resistance: Max. 30 mΩ (Power terminal) Max. 90 mΩ (Signal terminal) Composite removal force: Min. 0.165 N/pin contact x pin contacts |
Repeated insertion and removal cycles of Max. 200 times/hour | |
Unit weight | 10 pins Socket: 0.008 g Header: 0.003 g 30 pins Socket: 0.013 g Header: 0.006 g 60 pins Socket: 0.021 g Header: 0.010 g |
Part name | Material | Surface treatment |
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Molded portion | Heat resistant plastic (UL94V-0) |
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Power terminal (Socket / Header) |
Copper alloy | Contact portion: Au plating over nickel Terminal portion: Au plating over nickel (except for top of the terminal) |
Signal terminal (Socket / Header) |
Copper alloy | Contact portion: Au plating (Min. 0.05 μm) over nickel Terminal portion: Au plating over nickel (except for top of the terminal) |
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